Steffen Kröhnert
Steffen Kröhnert is President & Founder of ESPAT-Consulting based in Dresden, Germany.
Until June 2019, he worked for more than 20 years in different R&D, engineering, and management positions at large IDMs and OSATs in Germany and Portugal, namely Siemens, Infineon, Qimonda, NANIUM, and Amkor, where he most recently served as Senior Director Technology Development.
Since 2016 Steffen has chaired or co-chaired the European SEMI-integrated Packaging, Assembly, and Test – Technology Community (ESiPAT-TC). Steffen holds an M.Sc. in Electrical Engineering and Microsystems Technologies from the Technical University of Chemnitz, Germany.Keynote summary
Semiconductor Packaging, Assembly and Test is a highly competitive market. OSAT (Outsourced Semiconductor Assembly and Test) and SPAT-SP (Semiconductor Packaging, Assembly and Test – Service Provider) business is under attack from two sides: Standard Packaging by EMS moving upstream, and Advanced Packaging by the Silicon Foundries and Material suppliers by moving downstream in the semiconductor supply chain.
EMS capabilities have improved over the last years allowing them to take a share of the strongly growing System-in-Package and Heterogenous Integration business. In times of de-globalization and regionalization, that’s an important contribution to an independent European Supply Chain.
