Abstracts

Advanced Automation, Robots, Cobots 3D Printing

Gregory Vance

Sr. Project Engineer | Rockwell Automation

Gregory Vance is a Sr. Project Engineer on Rockwell Automation’s PCBA Global Process Engineering Team and a certified LSS 6σ MBB focusing on manufacturing and business process improvements. He serves on the SMTA Board of Directors as VP of Expositions.

ABSTRACT

SMART IoT Work Boards for Manufacturing.

Industry 4.0 often focuses on equipment and assembly line performance. Overlooked are the kitting operations that supply the manufacturing lines to ensure that they have steady stream of material. Then once an electronic assembly has completed SMT, tracking and completing it through post SMT operations can be a labor intensive and daunting challenge. IoT tools were leveraged to create real time work boards to track SMT Kits and work in process (WIP) through electronic assembly to understand workload to align staffing, set priority and track partial orders to minimize WIP and changeover.

Stephane Huet

Group Operational Officer | Europlacer Ltd.

Stéphane joined the company in 1997 as an export customer service technician at just 22 years old. Despite his youthful age, he participated in many international equipment installations, providing valued support to our subsidiaries and distributors. After a four-year break at a screen printer manufacturer, Stéphane returned to Europlacer as a regional commercial engineer. In 2014, Europlacer’s succession planning programme positioned Stéphane to take over the management of the French facility. He joins the EMT in 2020 as Group Operational Officer.

ABSTRACT

Implementing CFX technology in a manufacturing environment.

As part of our commitment to enable customers achieve their Industry 4.0 goals, CFX has provided the unique opportunity that has lead us connecting our equipment to the modern IIoT-based Smart factory, increasing value opportunity from actionable data, both from factory MES solutions and machine vendors perspective. As the first pick and place vendor to achieve IPC official CXF accreditation, in this presentation, we illustrate two early use-cases involving CFX technology, that now pave the way for manufacturing in any sector to achieve true data-driven, Smart manufacturing goals with vastly reduced connectivity and deployment overhead, through the use of the CFX standard.

Thomas Marktscheffel

Director Product Management | ASM Assembly Systems

Thomas is working for ASM Assembly Systems and in his job as Product Manager he is responsible for defining and building the SW Integration Platform for ASM’s SMT # 1 Smart Factory. As a member of several IPC committees, he is strongly driving for global industry standards such as CFX and Hermes. Thomas has more than 20 years experience in the SMT industry.

ABSTRACT

Closed-Loop Process Optimization benefitting from Standards.

Smart Factories require continuous and reliable operation of all equipment. Expectations towards Smart Manufacturing concerning productivity, automation, flexibility, etc. are high, manufacturing shall run flexibly with high performance and quality without unnecessary stoppage. Hence, it is mandatory to always keep the SMT process within reasonable boundaries.

Closed-Loop Process Optimization continuously monitors the SMT process and derives corrective action in case the SMT process trends to cross the reasonable boundaries. This requires process data from different machines, and the effort of applying data analytics can be significantly reduced, if this data is comparable and interoperable between different vendor’s machines.

Fabian Autenrieth

Product Manager Material Logistics | ASYS Group

Fabian Autenrieth has been with the ASYS Group for over 10 years. Since three years he is product manager in the MATERIAL LOGISTICS division. He has many years of experience in the SMT environment and knowledge of various manufacturing concepts and material flow concepts.

ABSTRACT

Fully Autonomous Line.

Get to know the premiere of the world’s first “fully autonomous production line” from all sides! We will show you what is important during planning. How does the printed circuit board get to the line automatically? We will show how the entire material handling, i.e. PCB and magazine handling, as well as the handling of component reels for the placement process, and consumables for the printing process in your SMT line of the future can be done completely without operating personnel.

Mark Daglish

Technical Sales Engineer | GOEPEL electronics Ltd.

Mark Daglish is an Electronics Test Engineer with more than 40 years’ experience in the electronics industry. He is responsible for the company’s product ranges of Embedded JTAG Solutions equipment as well as Inspection Solutions.

ABSTRACTS

Smart automatic optical inspection module for integration into mounting and THT assembly stations.

THT assembly and many other mounting processes are still not fully automated due to economical  reasons. As a result, such work is usually carried out manually by appropriately qualified employees. The  MultiEyeS plus is a smart automatic optical inspection module for integration into mounting and THT  assembly stations.  

The system concept based on multi-camera image acquisition technology enables imaging with high  quality and detail resolution. Thanks to the AI functions used, the system is self-learning and works  completely reliably even without light shielding. Real-time monitoring of mounting and placement  processes directly at the assembly station is now a reality.

Central verification of test results from different inspection systems and production lines.

The software PILOT Supervisor allows central verification of test results from different inspection systems and production lines. The software module also integrates inspection systems (AOI, AXI, SPI) from other manufacturers. From a separate classifying station, an operator can evaluate the inspection result of different production lines – the usual equipment of the workstations in the respective lines can be omitted.

Smart automatic optical inspection module for integration into mounting and THT assembly stations.

THT assembly and many other mounting processes are still not fully automated due to economical reasons. As a result, such work is usually carried out manually by appropriately qualified employees. The MultiEyeS plus is a smart automatic optical inspection module for integration into mounting and THT assembly stations. 

The system concept based on multi-camera image acquisition technology enables imaging with high quality and detail resolution. Thanks to the AI functions used, the system is self-learning and works completely reliably even without light shielding. Real-time monitoring of mounting and placement processes directly at the assembly station is now a reality.

Smart Industry 4.0 – Software

Steve Kuhlman

CEO | Lean Power

Steve Kuhlman is an executive and entrepreneur with extensive experience building and leading sales, marketing and product teams for private and public companies. Most recently, Steve has been leading Lean Power, a company that transforms workforces into digital ready workforces.

ABSTRACT

Improving Data Collection Accuracy and Efficiency by Field Workforces.

Accurate data is the cornerstone of business information systems. However, management cannot make informed decisions if the quality is inaccurate or can’t be acquired efficiently. Data from equipment that utilize connected sensors is highly efficient and accurate. However, most facilities still have equipment that require manual data collection. The process and methods used to collect this data can have a tremendous impact on the accuracy. Digital work platforms provide  opportunities to improve the reliability and accuracy of manual data collection. This talk will share information on tools, processes, and best practices to ensure data is collected efficiently and accurately.

Andrew Scheuermann

CEO | Arch Systems

Andrew has over 15 scientific papers in the fields of semiconductor electronics and renewable energy and holds a PhD in Materials Science from Stanford where he accomplished a world record in silicon photoanode efficiency. Andrew co-founded Arch Systems in 2015.

ABSTRACT

Advanced Analytics and Action Management for Surface Mount Technology (SMT) Manufacturing.

Top-tier electronics manufacturers are moving towards complete data coverage of their surface mount technology (SMT) capabilities to enhance productivity through analytics and drive predictive actions. As standards and connectivity becomes ubiquitous, focus shifts to the speed of turning raw data into useful data and actions. Leveraging advanced capabilities, manufacturers are able in a matter of days to connect data sources from hundreds of machines to power global KPIs,  benchmarking, and feed global data lakes for advanced analytics. Advanced models, capable of automatic loss cause  classification, focus teams on implementing closed-loop feedback to maximize efficiency, machine utilization, throughput, and quality.

Carlos Rojas

Business Development Executive | Cisco

Works directly with Cisco Global Manufacturing customers to assist with their Industry 4.0 digitization efforts. Support sales teams to build strategic account plans for top enterprise global accounts in order to capture net new wallet from factory digitization projects..

ABSTRACT

Industry 4.0 – Future Scenarios in the Year 2025.

By 2025, the real value of an Industrie 4.0 Cyber-Physical deployment will come from process improvements automatically changing worker and machine workflows. The workflow in any enterprise is where change is realized most – not in some statistical analysis or IoT Project Award. An interconnected
manufacturing facility with a robust and open standards network will enable even more workflow improvements such as automatic parts procurement based on real-time production data and product design changes based on customer returns and satisfaction surveys. This will lead to automated machine
adjustments leveraging Machine Learning algorithms. It’s these changes to workflow that will create continuous improvement for workers so they can focus on their jobs – a self-learning plant if you will!

Naim Kapadia

Technology Manager - ATFE Group | MTC

Naim has been working with the MTC since 2012, developing capability in advance production system (APS) and additive manufacturing in Electronics (AME). Naim Kapadia has been responsible and leading the Smart Factory for Electronics  Manufacturing using legacy equipment project.

Prior to joining Naim has over 25 years of experience in the electronics manufacturing working for contract manufacturers and PCB fabricators.

Naim has participated and led many programs in the UK disseminating Montreal protocol , the development of Surface Mount Technology and lead-free implementation.

ABSTRACT

CFX Open-Source Hardware Interface.

The IPC Connected Factory Exchange (CFX) standard provides genuine plug and play IIoT data exchange between machines and supervisory systems across the whole shop-floor. In order to realize the benefit of CFX however, the whole value-chain of production stations should be considered, as any missing link becomes a blind-spot for even the most basic visibility and control.

This presentation introduces the CFX standards-based open-hardware interface project, designed to enable existing machines that cannot support CFX natively through software alone, to become part of the CFX communication infrastructure. We explore use-cases ranging from the building of “home-grown” boxes by end-users, through to pre-built solutions provided by original machine vendors, and discuss how this impacts Smart Factory Industry 4.0 realization, the additional opportunity for machine vendors, as well as how the standards-based approach with open-source community development and support works to the mutual benefit of all those in the industry.

Ivan Aduna

MES Software Developer | Koh Young America, Inc.

Ivan leads the Koh Young smart factory integration efforts for electronics manufacturing. His expertise mixed with theoretical and practical knowledge positions him with the ability to understand, adopt, and implement software  advancements from both the user and  supplier perspectives.

ABSTRACT

Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory.

Leveraging IPC-CFX, Koh Young can use AI-powered technology to help manufacturers realize a smart factory. These tools collect factory data on defects, optimization, traceability, and more to improve metrics, increase quality, and lower costs. Yet, successful CFX implementation on the shopfloor requires confidence that equipment has been qualified to IPC-CFX. In this presentation, we will explore how Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge using CFX and other software tools. Combined with IPC communication standards, the gates to a smart factory are open to anyone.

Manufacturing & Supply-Chain Security

Michael Ford

Senior Director Emerging Industry Strategy | Aegis Software

Michael is an established thought leader for Industry 4.0 best practices, and an active contributor in the leadership of industry standards. Michael regularly contributes articles, columns and blogs in several leading industry publications.

ABSTRACTS

IPC-1783 Component Level Authentication: Provenance in a global supply chain.

IPC-1783 CLA is a new standard under development by the IPC. Bringing together Process and Product Provenance data, as well as a unique digital finger print, it aims to provide a way for its users to authenticate the provenance of the products flowing throughout their supply chains. This paper provides a brief overview of the scope and the intent behind this new IPC standard as well as discussing how electronic products can be uniquely authenticated by using their electrical and visual properties.

Cybersecurity of manufacturing environments.

Cybersecurity is the type of thing everybody thinks they have, until they realize, too late and more often than not with disastrous consequences, that it’s not the case. As an ever-present threat, cybersecurity has become especially important in  manufacturing environments with the fallout of several cybersecurity incidents already affecting products and making their way in data centers, cars and other products across the world. Several standards try to guide companies to secure their environment, but the burden imposed is often too complex, affecting business performance.

In this paper we’ll look at the particular threats that electronics manufacturers have to deal with and how the new IPC 1792 standard fills the gap in the industry, allowing, should an attack succeed, specific identification of potentially
compromised products, leading to a safer manufacturing environment and product reliability.

Maik Seewald

Sr. Technical Lead, Industrial IoT, Automation Networks & Security | Cisco

Maik Seewald has nearly thirty years of engineering and security experience. He works as a Senior Technical Leader in Cisco’s Enterprise Networking Group. He focuses on the development of Industrial IoT architecture, security and standards for Cisco’s CTAO team.

Before Cisco, Maik was a senior research and development architect and CISSP for Siemens, specializing in systems, software, and security architectures in energy and industrial automation. Earlier, he held project management, architecture, and engineering positions at Infineon, Audi, Siemens COM, and AMD. Maik received a degree in Informational Techniques and a Qualified Engineer degree from Dresden University.

His special fields of interest comprise cyber security, system and software architecture of IoT/M2M systems and distributed intelligence. Maik Seewald is Cisco’s representative for communication, security and automation in IEC TC 57, IEC TC 65, DKE, IEEE, OPC UA, and UCA.

ABSTRACT

Protecting against the evolving threat landscape in industrial environment.

Cybersecurity needs of the industrial environment are rapidly evolving. Not only is it becoming more difficult and unrealistic to isolate the industrial environment, it is becoming more undesirable to do so, as machine learning and other tooling capitalize on cloud-based environments.

In this overview talk, we will provide an overview of the evolving threat environment that matches to this reality. Next we will discuss what each actor in the ecosystem can do to address these threats, including best coding practices, device authentication, use of the network for appropriate segmentation and auditing, such that both new and old deployments can be protected.

We will present a number of real threats, and a few examples of how they can be addressed, as well as the sort of tooling and operational support required.

Radu Diaconescu

VP of Business Development | Swissmic (SMT.ai)

Radu is an Electrical Engineer, with an M.Sc. in Management of Technology from EPFL (Swiss TechnicalInstitute), Lausanne, Switzerland. He has a vast industrial experience in the field of electronics and is currently managing Swissmic’s business development efforts and sits in the Board of Directors. He also
co-chairs the IPC 1782 Critical Components Traceability standard committee and the IPC 2551 Digital Twin Architecture standard committee.

ABSTRACTS

Authentication and Identity Security: Paving the way towards a self-sovereign identity public service for products.

Products nowadays are becoming increasingly complex, with billions of components, parts and subassemblies travelling throughout the supply-chain across the globe. Various “silo-based” traceability systems are used, each with their own merits and challenges, but having an end to end view is the
equivalent of finding a needle in a haystack, and then finding again the same needle in 5 other haystacks.

This presentation looks at the latest breakthroughs in areas such as distributed ledger (e.g. blockchain) and builds upon existing standards such as IPC-1782A and the Verifiable Credential standard from W3C, to provide the blueprints of a self-sovereign identity public service for the security of physical assets.

Supply Chain Risk Management for the Electronics Industry. How AI tools can close the loop between design and manufacturing.

Component shortages affect every single company and every single product nowadays. From lead times that can be longer than a year, to counterfeit component ingress, companies face risks that can lead to quality, reliability and even availability issues for their products. However tempting it might be to look at these issues as temporary ones, supply chain risk management for the electronics supply chain is becoming a crucial area for both OEMs and EMSs. In this paper we will
look at the latest developments in AI and ML and how tools like SMT.ai use them to close the loop between design and manufacturing and streamline the collaboration between designers and manufacturers.

Tovi Yadin

Innovation Solutions Manager | Siemens Digital Industries Software

Tovi Yadin is passionate about leveraging advanced technologies such as AI and ML to optimize manufacturing and make the  world a better place. In her current role she focuses on smart manufacturing and Industry 4.0, promoting Siemens’ data-driven manufacturing initiative.

ABSTRACT

Fighting malicious code and counterfeit components using AI.

Shortages in components are a known fact in the industry, forcing electronic manufacturers to depart from their trusted sources and purchase components in the free market. This shift is increasing the risk of counterfeit, out-of-date, recycled, and defective components from the standard 0.5-2% when
purchasing from trusted sources to 5-10% of purchasing in the free market. Using AI, big data, and integration with SMT pick and place vision systems and sensors, Siemens partnered with Cybord to provide a solution that achieves 100% component inspection coverage and accuracy exceeding 99.5%, and full traceability about the source of each and every component.

Next Generation Materials & Devices

Rudy Ghosh

Next Generation Materials & Devices | NovaCentrix

As the Technical Program Lead at NovaCentrix, Rudy Ghosh helps translate technical innovations into customer ready products. He works closely with NovaCentrix’s customers, technology partners, and collaborators across the world to solve technical challenges and identify new avenues for the application of NovaCentrix’s industry leading technologies in PulseForge tools and Metalon inks for printed and flexible electronics. As a technical expert in the printed electronics industry, he is often an invited speaker for a variety of printed electronics conferences. Rudy also works with the global business team to define and engage in commercial opportunities related to the technical program and furthers those areas of opportunity through industry outreach and engagement.

ABSTRACT

Photonic Soldering Temperature Sensitive Components with High Temperature Solder Alloys.

This work reports the latest finding on soldering temperature sensitive components, such as batteries and interconnects, using standard high temperature off the shelf lead free solder alloys (e.g. SAC305) utilizing the photonic soldering technique. These components cannot go through the oven reflow process for a
variety of reasons. Initial considerations and general design rules necessary for defining a photonic soldering process are detailed. This presentation will highlight the advantages, provides an overview of the resulting solder joints and discusses the application space for the photonic soldering technology.”

Leland Smith

COO | Millibatt, Inc.

Dr. Smith has 13 years of experience engineering novel materials for power sources including solar PV, supercapacitors and lithium-ion microbatteries. He co-founded Millibatt in 2015 and currently leads Millibatt’s pilot manufacturing and process development efforts.

ABSTRACT

Relieving Battery Constraints on the Design and Manufacture of Wireless Sensors.

Batteries are essential components in most wireless devices, yet they introduce many challenges for design and integration. Batteries may require additional ancillary components like capacitors and power management circuits, increasing bill of materials, device size and complexity. Conventional attachment
procedures are incompatible with some batteries, and certain battery chemistries and formats pose the risk of catastrophic failure. Battery lifetime presents another challenge for long-duration sensing applications. This presentation will explain the root causes of these tradeoffs and discuss how they can be reduced or eliminated through the application of new materials and manufacturing techniques.