IPC CFX Update
Michael Ford, Aegis Corporation and Thomas Marktscheffel, ASMPT
As the unique importance and values of IPC CFX, IIoT-based, secure data exchange, with a single common defined language enabling true, plug and play support is recognized, industry uptake is accelerating rapidly. In turn, this is driving the need for additional content within CFX, and the ability to interface with such things as machines that cannot support a Smart interface, including complex devices that already use OPC-UA, MT-Connect, are PLC-based, and much more.
In this presentation, we explain important recent updates to the CFX standard, as well as mapping out how CFX is respectful to existing investments in connectivity. Having the ability to derive and exchange data with incumbent solutions, and PLCs that drive the majority of hardware automation, beyond Smart machines within SMT electronics manufacturing. This is co-presented by Thomas Marktscheffel and Michael Ford.
Event-Based Data: Building Expert Data Solutions to Capture Expert Knowledge
Gadi Meik, Arch Systems
Advanced AI Ecosystem Platform
Michael Ford, Aegis Corporation
A successful AI-based ecosystem, has certain requirements that go well beyond the messages of simplicity currently extolled by vendors across the industry, where to their marketing teams, “AI” is the new “Industry 4.0.”
In this presentation, we explore the reality of what AI’s actually are, the requirements that they have on data quality, quantity, format organization, context, and holistic data-model, as well as digging in to find out how these algorithms, “learn”.
Not all that we learn brings value. Even humans often end up accepting, “fake news”. The old adage, “Garbage In, Garbage Out” is equally applicable to AI training. Application of generic AI modules, provided today as public mini-applications, can work, but merely represent tools that need extensive skills and judgement in order to be successfully utilized. Plugging in new technologies that support existing, simplistic, tired old metrics, brings each a little more life, but is this the best that we can do?
No, not at all.
Implementing a single and unified digital thread will allow Electronics manufacturers to overcome today’s most critical manufacturing Challenges
Oren Manor, Siemens Mentor
In this session we will outline the key challenges affecting our customers and other electronic manufacturers including the continuous transition to high-mix production & high volume of NPIs, maintaining quality levels in small batch production, increasing profitability while production costs are rising and minimizing delays due to material shortage. We will introduce the components required to build a comprehensive Digital Thread for Electronics Manufacturing. We will show how an interdisciplinary solution covering manufacturing engineering & planning, manufacturing quality, manufacturing execution, manufacturing intelligence and manufacturing quality can solve these key challenges and allow manufacturers to be prepared for future trends.
From Warehouse to Feeder – Labour-optimised Component Delivery
Rob Raine, ASMPT SMT Solutions
Today, a lot of labour is spent in finding the right reel and getting it to the right place at the right time to avoid production stoppages. In this presentation, Rob identifies the value in software-controlled, automated short-term prediction, and how it can be combined with currently available smart systems to ensure material is ready in time, or issues identified long before an unexpected and expensive line stop can occur.
Automating Detection of Pick & Place Nozzle Anomalies
Gregory Vance, Rockwell Automation
Smart manufacturing requires quick decision. In this work, the initial steps of data acquisition, storage and processing will use secured edge and cloud computing environments. The business value is to provide smart manufacturing for electronic assembly machines by adding business intelligence into decision-making. This creates actionable analytics by measuring and visualizing the SMT pick and place machine nozzle performance in real time and automatically alerting personal of opportunity. This tool identifies anomalies, and trends for reducing downtime and defects while driving operations productivity.
Ultra-precise printed electronics supporting sustainable production
Kamelia Duczmal, XTPL
A platform solution: XTPL Delta Printing System with its deposition technology and high viscosity conductive inks provides ultra-high resolution and precision for rapid prototyping applications. XTPL offers an additive process enabling miniaturisation and novel designs for More than Moore devices (IoT, RF, antennas, chips), as well as contributing in sustainable manufacturing by i.e. open defects repair on displays – increasing the yield and reducing electronic waste. XTPL technology allows for adding conductive structures on the individual micron scale (1-8 µm). The process requires no electric field, which fully eliminates the risk of damage to electrically active components on the substrate.Lab On (In) A PCB
Despina Moschou, University of Bath
Lab-on-Chip technology aspires to shrink biomedical laboratories in few cm microchips, in a technological revolution step analogous to the introduction of computer technology in the 20th century. In this presentation Dr Moschou will provide an overview of this technology and its impact on healthcare. She will then focus on manufacturing techniques for integrated Lab-on-Chip biomedical diagnostic chips and in particular the Lab-on-PCB technology that has been the forefront of her work for the past 12 years. The role of this technology in the COVID-19 outbreak will be presented, along with its potential in reshaping the future of testing and data-driven management of emerging pandemics and non-communicable disease management.
Realtime Control 4.0: How AI supports Process Control
Axel Lindloff, Koh Young
In electronics, components are shrinking and processes are more complex. Yet, manufacturers are striving for fully-automated production. Using AI, they have a solution. AI can simulate human behavior and decisions. In the past, it needed super computers, but today the available computing power and intelligence application strategies give us new possibilities for AI in the manufacturing process. Whereas some make quick decisions based on past experiences, AI is based on data. It mimics the human decision process in seconds, while considering large data piles. The webinar will explore the possible benefits and advantages of applying AI in an SMT line.
Cyber-Physical Security in the Smart Factory
Ryan Hartfield, Exalens
Smart Factories bring both opportunity and risk. IT and OT convergence is increasing automation, and optimising processes. It is also bridging computer systems and physical machines in an unprecedented way. The factory is becoming more cyber-physical, at a system and process level, so, how we monitor it for Safety, Reliability and Availability must too. We provide an overview of this challenge, describe how Cyber-Physical monitoring helps answer the question: Is abnormal process behaviour caused by a cyber threat or equipment fault, and how it improves IT and OT teams’ collaboration when responding –the difference between shutting down production, or not.
Improving quality by data driven decision processes based on Big Data Analytics in EMT business
Kristin Vogelsang, Keysight
Keysight’s PathWave Manufacturing Analytics (PMA) software is a Big Data Advanced Analytics as-a-Service platform for Industry 4.0, that enables electronics manufacturers to improve their production processes by collecting and analyzing data from the manufacturing floor. It provides real-time visibility into manufacturing operations, allowing to identify and resolve issues, optimize production, and increase yield. PMA includes advanced analytics capabilities such as machine learning and AI, enabling companies to make data-driven decisions. PMA helps to identify root causes of quality issues using historical data. We will demonstrate how customers experienced increased productivity through real-time analysis of global operations, troubleshooting, and scrap prevention.
The Hidden Reliability Cost of Degraded Components in Electronic Products - new vision on electronic product MTBF calculation
Eyal Weiss, Cybord
The traceability of electronic products, which involves recording the materials that comprise each product, is a well-known concept. However, a new capability known as Exploratory Traceability has emerged that can significantly enhance failure analysis, quality assessment, and reliability assessment. Exploratory Traceability involves saving visual images of the bottom side and top side of each component during placement by the pick and place and automated optical inspection (AOI) machines, respectively. These images enable direct verification of component quality, authenticity, and evidence of corrosion, mold, cracks, and other defects. They can also be used to perform failure analysis and identify common failure causes. The images are stored for each individual board, creating a powerful database for evaluating component quality and identifying potential issues. In the case of a recall, the database allows for targeted returns of only the affected PCBs, a feature that has been termed “surgical traceability.” This feature allows for the tracing of each individual component issue and avoids a general recall by enabling the targeted recall of contaminated boards only. This presentation will discuss the Exploratory Traceability capability and its potential applications in engineering, manufacturing, and quality control, highlighting its value in enhancing product reliability and quality assessment.
