eSmartFactory Conference Agenda - Day One

08:00 -- Registration Opens

Software Systems & Process – Session Chair: Trevor Galbraith

08:30 -- Keynote: Building an AI-ready Culture - presented by Irene Petrick, Ph. D., Intel Corporation

Successful digitization requires a strategic fit between technology, process and people.  The “right” solution may look different, depending on where you are now and the competitive drivers of your industry.  Companies must consider (1) how to build data driven thinking, (2) how to link AI goals with the compute architecture; and (3) how to jump the ambition to execution gap.

Dr. Irene J. Petrick joined Intel in 2015 and is Senior Director of Industrial Innovation in the Internet of Things Group.  Irene focuses on emerging technology, social, and global trends and their combined impact on the industrial space.  Her work highlights the industrial internet of things, edge computing, the transition to intelligent manufacturing and the needs of the future workforce, 3D printing and distributed manufacturing and the new business models that are enabled by intelligent manufacturing.  Prior to joining Intel, Irene was a professor at Penn State and has been actively engaged with companies in their innovation and technology strategies for over 25 years, including work with twelve Fortune 100 companies, the U.S. military, and a wide variety of small to medium sized enterprises. Petrick is author or co-author on more than 180 publications and presentations.

09:10 -- How IPC Digital Standards Are Pivotal for Industry 4.0 Achievement - presented by Hemant Shah, Cadence & Michael Ford, Aegis Corporation

IPC has become the leader for digital manufacturing standardization, with a combination of standards now providing the backbone for open Industry 4.0 adoption, which critically includes “Design For Industry 4.0” . The adoption of IPC standards  provides an excellent opportunity to exchange electronically executable data between design houses and their manufacturing partners, enabling flexibility of product assignment. Electronic exchange of data utilized through IPC standards in a timely manner enables design houses to improve product quality, performance, reliability and cost.

This paper talks about how The IPC Digital Product Model (IPC-2581) working with IPC Connected Factory Exchange leverages the benefits derived from the adoption of Industry 4.0 in the factories. It provides an update on continued adoption of IPC-Digital Product Model (IPC-DPM / IPC-2581) in the industry, the adoption of IPC-Connected Factor Exchange (IPC-CFX / IPC-2591) and where the two standards are going to improve your product quality, performance, reliability and cost.

Hemant Shah is group director of product management for PCB products at Cadence. He joined Cadence in late 2000 and is based in Chelmsford MA. Shah led the effort to create an industry wide consortium of design and supply chain companies to get IPC-2581 – the standard for transferring PCB design data to manufacturing – adopted. Prior to managing the PCB and FPGA products, he managed the Allegro Signal and Power Integrity products for PCB & IC Packaging. Shah also led an industry wide effort to get a new algorithmic modeling standard (IBIS-AMI) approved and adopted.

Prior to joining Cadence Hemant worked at Xynetix Inc. and before that at Intergraph Corporation. He is passionate about developing, marketing leading edge software products for PCB design.


Michael Ford, Working for Aegis Software provides him the opportunity to apply his many years of electronics assembly manufacturing experience, to drive both business and technology solution innovation that satisfies evolving needs in digital manufacturing.
Starting his career with Sony, including eight years working in Japan, Michael has created many solutions for manufacturing that blend a deep and broad knowledge of manufacturing with evolving software technologies.
Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to industry standards together with the IPC, in the areas of the Connected Factory Initiative (CFX), traceability and the digital factory platform.

09:50 -- Deployment Excellence - Electronics Production Process Planning - presented by David Meyers, Siemens PLM

Having a digital enterprise strategy is required to remain competitive. Traditionally, electronics manufacturing has been a separate and siloed part of the overall product development process. Electronics assembly manufacturing have predominantly siloed, disjointed ecosystems, organizations and processes. In this session you will see how you can leverage a product lifecycle management platform for multi-BOM and manufacturing data management, process planning, electronic work instructions, and production optimization, along with process validation tools for electronics manufacturing. Ensure your manufacturing or manufacturing partners are synchronized with design changes, manage Bills of Process with strong governance, and finally bring electronics manufacturing into the digital thread of the product design lifecycle. This session focuses on how electronics manufacturing can be part of an organizations’ enterprise digitalization strategy, what steps to take, and most importantly, success stories of organizations at different stages in their journey to closing the digital gap from Product Design to Production Execution.

10:30 -- Coffee Break

Enjoy complimentary coffee provided by eSmart Factory.

11:00 -- Smart Manufacturing – Shifting the Focus from Machine to Product - presented by Michael Schuldenfrei, Optimal Plus

Smart Manufacturing, IIoT and Industry 4.0 bring tremendous value to manufacturing operations. By collecting and analyzing data from equipment they enable companies to improve manufacturing line efficiency and throughput. But why stop there? In this presentation, we will introduce a “twist” to the IIoT story and show how much more significant value can be created by adding “product” data into the mix, leveraging artificial intelligence and analyzing the full lifecycle of the product. By collecting data from the manufacturing process and associating it with each individual product, we are able to construct each product’s “DNA” improve the product’s quality and reliability. However, product analytics requires a different approach to data collection, modeling and analytics and we will describe the challenges and show how leading manufactures are overcoming them.

Michael Schuldenfrei joined OptimalPlus in 2006, and brings over 30 years of software and information technology experience. Since joining the company he has served in several leadership roles including Chief Software Architect and CTO.
Prior to that he served as Senior Software Architect at SAP, where he led a joint development project with Microsoft. He was also a Software Architect at Microsoft, where he led consulting engagements with the company’s major customers, and VP of R&D at ActionBase, heading up development of the company’s business management enterprise solutions.

11:40 -- Industry 4.0 the Next Industrial Revolution - presented by MB Allen, KIC Thermal Systems Inc.

Industry 4.0, IIoT, IoT, Smart Factory, Made in China 2025. It’s all the buzz but what are these trends?  Do they relate to me and my manufacturing environment? Is this something we Must implement? What would the benefit be to my company? How does it all come together?

These questions and more will be covered during this presentation and will include an example of ‘Smart Factory’ technology.

MB Allen is a manager for KIC’s Applications & Sales in the Americas and Europe. Formerly as Product Manager she coordinated the advancement of new products and features to accommodate customer needs as KIC added to its portfolio for the electronics industry. Her technical expertise, relationships with valued partners and customers, and many years of sales experience aid KIC in the future development, improvement and sales of the company’s product offerings.
MB has worked in electronics industry for 31 years and been associated with KIC for 30 years with both national and international positions.
KIC’s line of products provide the solutions needed for a Smart Factory.

12:20 -- Lunch Break

Software Systems & Process – Session Chair: Keith Bryant

13:20 -- How AI is Changing the Way We Make and Inspect Things - presented by Bill Cardoso, Ph.D., Creative Electron Inc.

Over the past years, the electronic assembly industry has focused on the development of Industry 4.0, a standard communication protocol that allows production equipment to dialogue. This communication protocol will be a key enabler to improve the quality and efficiency of the production line. This is achieved by creating a feedback loop between inspection and production – thus allowing problems to be identified and corrected as early as possible in the manufacturing line. As a result, the overall cost of manufacturing is reduced as yield increases. In this presentation, we will share the latest developments of the integrated production line with Industry 4.0. The Connected Factory Exchange (CFX) software, IPC’s answer to Industry 4.0, will be discussed as a powerful solution to factory connectivity. The connectivity of the production line is an important first step in the development of the next generation of electronic manufacturing. The next key technology that will build upon the connected factory and make a tremendous impact in our industry is artificial intelligence (AI). AI will allow us to scale the conversion of data into information – and how this information can be utilized to improve the decision-making factory in the digital factory. We will share examples of state of the art xray inspection applications with AI that greatly improve the productivity of electronic manufacturing. As a natural extension of this work, we will present how AI will change the way we manufacture and inspect electronic devices.

Dr. Bill Cardoso started his first company at 17 in Brazil, selling it a few years later to work for US Department of Energy’s Fermi National Accelerator Laboratory (Fermilab). At Fermilab bill led research in nuclear physics to build the equipment that discovered the Higgs Boson (and the 2013 Nobel Prize in Physics). After 10 years at Fermilab, Bill was ready to get back to the entrepreneurial life. He moved from Chicago to sunny San Diego to start Creative Electron in his garage in 2008. Creative Electron is 10 years old now, and after the acquisition of FocalSpot in 2016, it became the largest US manufacturer of x-ray systems to the electronics industry. Creative Electron’s fast growth has been driven by its artificial intelligence expertise combined by a core competency in x-ray inspection. At Creative Electron, Bill leads the team of engineers and scientist who combine AI and x-rays to deliver the most intelligent x-ray machines in the market.
Bill received his Associate’s Degree at 13 and went on to achieve a BS, MS, and PhD in Electrical and Computer Engineering. Bill also has his MBA from University of Chicago. He is a recipient of the Outstanding Alumnus Award from IIT, and sits on the technical committees of SMTAI, SMTA Counterfeit Conference and SMTA LED Conference, Components for Military and Space Electronics Conference, SPIE Photonics, and the IEEE Nuclear Science Symposium. He’s on the Board of Directors of MiraCosta College and on the Board of Advisors at the Illinois Institute of Technology. He is also a global board member of the SMTA. Bill has contributed to two books and over 150 technical publications.

14:00 -- Automating Detection of Pick & Place Nozzle Anomalies - presented by Greg Vance, Rockwell Automation

Smart manufacturing requires quick decision making. This means product and process performance needs to have capabilities to be able to monitor, provide actionable insights, ability to perform data analysis, identify root cause analysis and predict product and process behaviors. The Digital Transformation has enabled Big Data solutions that have ability to capture real time data at scale from manufacturing processes. Applications and tools exist to transform the process data into meaningful insights to visualize process anomalies, but typically required users to
observe the condition as it develops limiting its effectiveness. In this work, the initial steps of automated data acquisition, data harmonization, contextualization, storage and processing capacity will use the best of secured edge and cloud computing environments to provide smart manufacturing vision on a legacy electronic assembly manufacturing system. This endeavor combines these two level computing settings to create actionable analytics and visualizations for electronic assembly process by measuring pick and place machine nozzle performance in real time.  This solution allows the machine operators and production support personal to visually identify a nozzle anomaly in the production process as they emerge and outlines a custom algorithm to track performance over time that is configurable to adjust it sensitivity to automatically detect an anomaly condition and notify support personal to investigate and resolved the root cause sooner. The custom algorithm is coupled with machine learning to predict the performance of nozzle in the near future to attempt to identify anomalies sooner. Looking into the future; these will tools will help identify anomalies, trends and new correlations. This will reduce downtime and defects that will drive operations productivity.

Greg Vance is a Sr. Project Engineer on Rockwell Automation’s Printed Circuit Board Assembly Advance Manufacturing Engineering Team focusing on manufacturing and business process improvements.  He has worked at Rockwell Automation for 25 years in various roles supporting Electronic Assembly process development and as a Lean Six Sigma Project Manager. Greg holds a Bachelor of Science in Mechanical Engineering from the University of Akron and is a certified Six Sigma Master Black Belt.  On a personal note, he is married to Amy with two children, Jenna and Jared and resides in Brunswick, Ohio.

14:40 -- Smart PCBA Manufacturing: How Software-Powered Automation Increases Innovation and Reduces Production Time - presented by Shashank Samala, Tempo Automation

Driven by aggressive deployment and production cycles, engineers developing printed circuit boards (PCBs) for critical systems in aerospace, medical technology, industrial, automotive, and other competitive industries need the ability to rapidly iterate on their designs. However, while PCB design and manufacturing is core to many new innovations, it also remains a bottleneck in the product development process. The traditional electronics manufacturing process for prototypes is slow, opaque, and low-quality. This is due in part to the fact that the machines and people are all analog and disconnected, making the factories islands of isolated technology. Without any kind of IIoT network, these old-fashioned factories are unable to provide engineers with insight into the outcome of their designs prior to manufacture.

A smart factory, on the other hand, deftly uses IIoT to automatically configure, operate, and monitor its prototyping and low-volume printed circuit board assembly. IIoT fills the communication gap between designer and manufacturer by automating the flow of information from the engineer’s design to the machines and the people on the connected factory floor in a continuous cycle of design, build, and test. This cycle enables designers and manufacturers to work synergistically in an end-to-end feedback loop, ensuring quality, speed, and accuracy in PCB assembly. And with accelerated production time and increased feedback, designers are able to produce more iterations to continuously improve their designs.

Besides facilitating transparent communication between designer and manufacturer, a rich IIoT network also streamlines operations. For example, a smart factory with sensors connected throughout can monitor things like temperature, humidity, equipment status, job progress, and reported defects. All of this connected data can give engineers insight into how the factory is operating, which they can then use to optimize the engineering process.  This presentation will treat IIoT in PCBA manufacturing, detailing how software and automation processes can empower engineers to bring their innovations to market more quickly by drastically reducing production time and giving them the feedback they need to continuously reiterate their designs for improved innovation.

15:20 -- Coffee Break

Enjoy complimentary coffee provided by eSmart Factory.

15:50 -- Watchdog Technology for SMT Assembly - presented by Jim Villalvazo, InterLatin

This concept consists of an open-ended comms system which monitors, in real-time, the SMT Printer process, which still defines 70-80% of the SMT line defects which impairs the level of business sustainability. This system provides improved, defined levels of information, monitoring specific process requirements, during the SMT printer process. Tracking critical process parameter, it is completely configurable to monitor any process parameters permitted by the SMT Machine. As the demand grows this capability can be expanded. This application is readily available to all SMT Printer users and is NOT brand restricted. Its Open Comms Infrastructure allows the collected data reports to be stored and supported by any MES system. Supporting Traceability requirements, the data is recoverable for traceability, down to the serialized board level. Outlining the registered SMT Printer process requirements. Historical data can be extrapolated, analyzed and utilized to define changes which would enhance business sustainability. Creating best practices with data to support the actions. Making this information available 24×7. The collected data to be analyzed by the watchdog system, utilizing configurable menus, the system can send monitoring information periodically or during preconfigured alarm conditions, making this a mobile app for all formats. Utilizing a simple WIFI connection to monitor a system running in California, while in a meeting in Mexico. Any violation(s) pre-defined condition(s), by the user, will activate a simple to read message to a defined mobile to help monitor/control the current process or conditions expected from a given SMT assembly process. Controlling the machine activity, by monitoring its activity and establishing escalation points/levels of notification. The system will monitor machine downtime to support OEE requirements. RFID tags attached to the stencil will count the repetitions the stencil is utilized. Once the stencil is deemed no longer valid, it will halt the print process. The same standard applies if not all the specified components to the process are within the configurable requirements established by the process controlling bodies. Augmented Reality, enabling you to be able to see the actual monitor system atop of the printer/machine, physically from anywhere, using an activation Mark to help support a predesigned application of the given floor plan. The future of this process will grow, we see apps within other processes demanding this level of TRACK/TRACE/Control, enhancing the IOT reaches. Some examples are: Paste pre-conditioning; Wave and Selective Pallet; SMART Gripper, Odd form placement; Stencil Re-order, JIT and many others.


Jim Villalvazo with over 35 years experience in the electronic industry.
-12 years in the Silicon Valley, as Technical Writing Engineering Manager
-5 years working directly with DEK printing machines.
-18 years and currently working in the SMT environment in Mexico. Headquarters Guadalajara Jalisco, Mexico.
Serving in the USMC for 4 years, prior to the work experience, as a Technical Communications Support Technician.
Utilizing the strategies and the disciplines, from past work experience, in evaluating processes, I have sought to find a permanent solution to issues which limit the productivity aspect of the SMT Screen Printing Process.

16:30 Panel Discussion

Irene Petrick (Intel), Michael Ford (Aegis), David Meyers (Siemens PLM), Michael Schuldenfrei (Optimal +) – Moderator: Trevor Galbraith (Global SMT & Packaging)

17:10 -- Conference Ends

See you on day two Friday, July 21st!


We are extremely pleased to announce eSmart Factory Conference tour. It all starts on Day One of the conference June 20th at 5.30PM. Only a short walk, with free shuttle from and to the hotel plus limited car parking at The Ford River Rouge Complex (commonly known as the Rouge Complex or just The Rouge) is a Ford Motor Company automobile factory complex located in Dearborn, Michigan, along the River Rouge, upstream from its confluence with the Detroit River at Zug Island. Construction began in 1917, and when it was completed in 1928, it was the largest integrated factory in the world. Designed by Albert Kahn, the Rouge was designated as a National Historic Landmark District in 1978 for its architecture and historical importance to the industry and economy of the United States.

Ford Rouge Factory Tour Includes

  • Legacy Theater – Learn about the triumphs and tragedies surrounding the Rouge, much of it told through rare, never-before-seen historic footage.
  • Manufacturing Innovation Theater – A multisensory exploration of the manufacturing experience, from concept to highway
  • Observation Deck Tour – View the ground-breaking living roof from our 80-foot-high Observation Deck.
  • Assembly Plant Walking Tour – See where the new military grade aluminum-alloy body Ford F-150s are assembled in a lean and flexible manufacturing plant.
  • Legacy Gallery – View five historic vehicles made at the Rouge and hop in a new F-150 Raptor.

Today, the Rouge site is home to Ford’s Rouge Center. This industrial park includes six Ford factories on 600 acres (2.4 km²) of land, as well as steelmaking operations run by AK Steel, a U.S. steelmaker. The new Dearborn Truck factory famously features a vegetation-covered roof and rainwater reclamation system designed by sustainability architect William McDonough. This facility is still Ford’s largest factory and employs some 6,000 workers. Mustang production, however, has moved to the Flat Rock Assembly Plant in Flat Rock, Michigan.

Tours of the Rouge complex were a long tradition. Free bus tours of the facility began in 1924 and ran until 1980, at their peak hosting approximately a million visitors per year. They resumed in 2004 in cooperation with The Henry Ford Museum with multimedia presentations, as well as viewing of the assembly floor. The Ford Rouge Factory Tour had 148,000 visitors in 2017.

The management of Dearborn Truck has decreed that no vehicles from other manufacturers may park at the front of the main employee lot. Non Ford Family vehicles are required to park in the back 12 rows of parking spaces. Hourly workers from both Ford and AK Steel facilities at the complex are represented by UAW Local 600.

A fleet of three Ford-owned Great Lakes freighters initially named for the Ford grandsons or later, renamed for top company executives, was based at the River Rouge Plant. When the ships were retired, one was scrapped, but the deckhouse of the SS William Clay Fordwas relocated to a museum in the Belle Isle Detroit city park in the Detroit River and the deckhouse of the SS Benson Ford was transported by crane barge to Put-in-Bay, Ohio and placed on an 18-foot cliff as a private home above Lake Erie.


eSmartFactory Conference Agenda - Day Two

08:00 -- Registration Opens

Augmented Reality and Alternative Systems – Session Chair: Greg Vance, Rockwell Automation

08:30 -- Keynote: Augmented Reality, Next Generation Computing for Front Line Workers - presented by Brian Toleno, Ph. D., Microsoft

Market projections put the virtual reality, augmented reality, and mixed reality (VR/AR/MR) devices at anywhere from 90 to 120 million devices per year by 2022. Today on the market there are a number of VR devices – mostly designed and marketed for entertainment. Basic augmented reality in the form of 2D images superimposed on video or pictures on our cellphones (e.g. Pokémon or Instagram filters) also exist today, mainly for entertainment. The next level of this application would be 3D digital objects placed to locked positions in the real world or a mixed reality. With respect to mixed reality the ability to project 3D images into a user’s field of view has many exciting applications in the industrial space with the ability to provide real-time information or images fixed in-space to a real-world object. In addition, these devices can be used to improve and supplement training moving from a manual or computer screen to interfacing with a virtual three-dimensional object. The Microsoft HoloLens is one example of a mixed reality device. The HoloLens is an untethered holographic computer that creates high-definition, 3D holograms using advanced nano-optics. These become part of the real world through on-board processing of data from an array of sensors continuously sampling the user’s environment. HoloLens combines all the processing and components in a form factor that enables interaction with the real and the virtual in a most natural way. We have found that across industries, customers consistently struggled with the following scenarios: remote assistance, space planning, training, collaboration, and spatial insight. Whether connecting technicians and remote experts in a heads-up, hands-free way or visualizing physical space designs in the real world, what all of these scenarios have in common is the need to bring digital information into the physical context of employees’ work.

Recent research reflects these business needs as well: in a 2017 Forrester study and a 2018 Harvard Business Review Analytic Services report, survey respondents similarly identified remote collaboration, 3D visualization, employee training, and complex task completion as top areas mixed reality would help their organizations solve.

In his keynote Dr. Toleno will share some of the technical challenges and triumphs as well as illustrate several practical applications of this innovative technology for smart factories.


Brian J. Toleno, Ph.D. is currently the Director of New Technology at Microsoft working on mixed reality devices, in Mountain View, California.  In this role Brian leads a team evaluating and selecting materials and new technologies for use in these next generation devices.  Prior to this role Brian was the Director of Global Product Management for Henkel Electronic Materials, LLC in Irvine, California where he managed the underfill and encapsulant business. Brian obtained a Ph.D. in analytical chemistry from Penn State University, and his B.S. in chemistry from Ursinus College.  Brian is an active member of and is also a frequent speaker and contributor to SMTA. Brian has written courses on underfill materials, Pb-free soldering, and failure analysis, and two chapters for electronic engineering handbooks on adhesives and materials.

09:10 -- Human Automation: Hands-Free Industry 4.0 - presented by Michael Ford, Aegis Corporation

So many examples already exist of the utilization of Augmented Reality (AR), as it relates to assembly manufacturing operations. The vast majority of these are demos, carefully and painstakingly crafted to show the potential of the technology. Others are somewhat niche cases of real applications, again however, supported by significant customization and preparation behind the scenes, for each and every application instance.  This is only the first step however for Augmented Reality technology, which has a central part to play in our standards-driven Industry 4.0 Smart digital factory. AR provides hands-free, fully focused assembly support, when properly integrated into the latest digital MES tools. Providing interactive step by step guidance, allows operators to be fully flexible, without the need to be experts or specifically experienced in what they are doing.  This presentation details how AR technology available today, is to be a critical part of any Smart digital Industry 4.0 factory, sooner than you may think.

Michael Ford, Working for Aegis Software provides him the opportunity to apply his many years of electronics assembly manufacturing experience, to drive both business and technology solution innovation that satisfies evolving needs in digital manufacturing.
Starting his career with Sony, including eight years working in Japan, Michael has created many solutions for manufacturing that blend a deep and broad knowledge of manufacturing with evolving software technologies.
Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to industry standards together with the IPC, in the areas of the Connected Factory Initiative (CFX), traceability and the digital factory platform.

09:50 -- Ready for Next Generation Software Concepts - presented by Carsten Kramer, Rehm Thermal Systems

Rehm is always at the forefront when it comes to setting new standards in the field of thermal system solutions.  Rehm Thermal Systems is also among the leading innovators in plant engineering who are addressing the issue of Industry 4.0. An innovative concept with worldwide Augmented Reality Support should make maintenance, documentation and on-the-job-training easier from now on.  The advantages are obvious: reduced travel costs, availability anywhere in the world and shorter response times are just some of the highlights offered by the new software concept.  Planned to be integrated into the new ViCON it offers a virtual communication interface for maintenance support in modern electronics production. The innovative solution offers concrete support with the help of smart glasses, guided maintenance scenarios on tablet or smartphone as well as a comprehensive and expandable knowledge base.  The three pillars in detail: The Documents area includes a library with all the relevant documents needed for operation and maintenance of our systems. These include the system documentation, circuit diagrams as well as the operating and maintenance instructions. The Instruction area includes training course content and step-by-step instructions which can be projected directly into the given tasks with the help of smart glasses. The end user is trained in his specific field, directly on the system using the available scenarios – at the precise point in time when the exact knowledge is required.  In addition to scenarios for the smart glasses, videos for other devices such as tablet, smartphone or PC are available.  If the help of a service technician is necessary for service and maintenance tasks or troubleshooting, Support is available quickly and easily using smart glasses. To diagnose a problem, the operator on site and the service technician look at the system at the same time. The service technician then guides the operator easily and efficiently through the process, he can also send documentation to the glasses to help or make markings in the operator’s field of vision. Clear advantage: This allows them to solve the task together, spontaneously and in a very short time, no matter where they are.  The bottom line is that this new solution helps to reduce machine downtimes and costly service visits and thus ensures maximum system availability at all times.  Scheduled maintenance visits and spares management also ensure that production is working to full capacity. Critical areas of the plant can be continuously monitored and activity reports of maintenance work to be carried out displayed.

10:30 -- Coffee Break

Enjoy complimentary coffee provided by eSmart Factory.

11:00 -- Smart Factories: Solving Real-time Data Challenges for Predictive Maintenance - presented by Jamison Shaver, SWIM.AI

Manufacturing around the world is currently undergoing the next phase of digital transformation. With sophisticated supply chains and the introduction of “just-in-time” processes, they’ve moved from mass production to mass customization in an effort to meet increasingly high customer expectations.

The future of manufacturing needs to adapt to meet these increasingly dynamic needs of the customer. Data generated by most factories is too voluminous to send to the cloud and batch processes add too much latency for making real-time decisions. Furthermore, adding data scientists and algorithms is too complex for most organizations, as is trusting a third party that doesn’t have the institutional knowledge of the factory.

This talk will introduce a different approach to the future of manufacturing that adapts to the increasingly dynamic needs of the customer. Becoming a software-enabled organization can help toward creating smart machines with the ability to automate failure detection and prevent downtime, improving quality and reducing waste.

For example, Rockwell recognized they needed a solution that drives real-time insights, as factory operators and line engineers make complex decisions every day. The team identified the opportunity to incorporate operational knowledge and expertise into software applications for creating “smart machines.” They chose to deploy SWIM.AI’s application platform, Swim, which provides them with a single, unifying code base that can run anywhere to analyze and act on streaming data as it’s created. Swim has now been deployed in U.S. factories and seamlessly analyzes over 100 million data points across thousands of production runs.

11:40 -- Digitalization of Manual Assembly Process on your Shop Floor - presented by John Johnson, Electronic Assembly Products

Industry 4.0 and Digitalization for assembly are about flexibility and automated adaptable processes to meet your production needs on the shop floor. In today’s manufacturing environment it is becoming more challenging to adapt the manual assembly processes with the changes in variants you manufacture as well as the impact on employees training, stress and ultimately your quality. By digitalization of your parts from incoming goods, you can control quality through the entire process from receiving department to the shipping department. Digitalization will allow for changes to be made to your products while being easily adapted as a digital twin for the assembly process. By implementing a digital twin of your parts, you can utilize their digital shadow through the assembly, final inspection and shipping department, you can increase productivity and quality. The complexities of assembly steps and variant changes also add stress to the workforce require continuing training, reduced productivity and errors. By controlling this you can reduce / eliminate your errors and end customer complaints. We will discuss digitalization assistant options for the assembly environment and how it can improve your productivity and quality while improving the human OEE.

John Johnson is the President of Electronic Assembly Products, Ltd (EAP). EAP is the importer of the Smart Klaus assistant system from Optimum GmbH. The Smart Klaus, an individual assistance system for industry 4.0 applications, which secures processes using intelligent image processing and supports employees in their daily work. The innovative all in one solution is applied in the areas of identification, assembly, control and order picking for companies in industrial manufacturing, logistics, aerospace, medical technology, automotive and electronics industries.

12:20 -- Reducing The Fake Electronic Component Ingress Using Blockchain - presented by Radu Diaconescu, Swissmic S.A.

Blockchain is one of the new technologies that is revolutionizing the banking industry. However, blockchain is more that just cryptocurrencies. It has the potential to change manufacturing as we know today. Several applications can be imagined but one of the first ones that we are going to explore is reducing the fake component ingress in the electronics manufacturing supply chain.

13:00 -- Lunch Break

Lunch Break

14:00 -- Integrating Automated APC Across the SMT Line to Revolutionize PCBA - presented by David Suh, Koh Young Americas

With a shortage of highly-skilled employees for printed circuit board assembly, the electronics industry faces a severe challenge, which is being complicated with a high turnover rate as employees jump between companies or simply become misaligned with the organization. While leading industry organizations like IPC and SMTA are tackling the issue head-on with education and training programs, a need exists for equipment suppliers to cooperate with other industry leaders and organizations to adopt Machine-to-Machine (M2M) communication standards.  Initiatives like the IPC Connected Factory Exchange (CFX) and The Hermes Standard (THS) underpin the efforts within the industry, and many companies are working together to develop standards to create seamless production.

Guided in part by Industry 4.0, these M2M communication standards are quickly altering the manufacturing process by improving metrics like first pass yield and throughput by applying autonomous process adjustments. Far beyond an automatic line changeover, this bi-directional communication allows equipment to automatically adjust production parameters to increase board quality and lower costs by eliminating rework and scrap.

Building on our expertise and testing, this presentation will explore component trends, and then examine how Advanced Process Control (APC) can increase production yields and reduce defects. Specifically, the presentation will discuss how APC-MFB (Advanced Process Control-Mounter Feedback), improves process repeatability by automatically adjusting component placement to the paste, rather than to the pad location. Moreover, it will show how APC-MFB will identify a shift trend and implement further position correction by using true 3D measurement data from the Automatic Optical Inspection (AOI) system. While a smart factory will help resolve the skilled employee challenge, it can also revolutionize process optimization.

14:40 -- 3D Inspection and Measurement for Factory Automation across Applications – presented by Subodh Kulkarni, CyberOptics Corporation


Dr. Subodh Kulkarni, has been a director of CyberOptics since 2009, Executive Chairman from September 2013 to February 2014 and President and Chief Executive Officer since February 2014, He was Chief Executive Officer from January 2013 to February 2014 of Prism Computational Sciences, a developer of software tools for scientific and commercial applications in simulation of hot gases and plasma used in many applications, including the semiconductor industry. He was Chief Technology Officer and Senior Vice President, OEM/Emerging Business , of Imation Corp from 2009 until 2012; Vice President, Global Commercial Business, R&D and Manufacturing of Imation from 2007 through 2009; Vice President, R&D and Manufacturing of Imation from 2006 through 2007 and other leadership roles. Prior to 2004, Dr. Kulkarni held various research management positions with 3M Corporation, and prior to that, with IBM. Dr. Kulkarni received his B.S. in chemical engineering, first in his class, from IIT, Bombay, India, and went on to obtain a master’s degree and a PhD in chemical engineering from the Massachusetts Institute of Technology, with thesis work on disilane surface decomposition used in the manufacture of semiconductors. He has won a number of awards for commercializing technologies he and others have developed in the electronics industry.

15:20 -- Inspection 4.0 - presented by Keith Bryant, Independent Consultant

This advanced technical solution combines the strongest in line inspection technology, which is 3D AOI with At-Line X-ray technology, giving Real Process Management.

But as so often it is not so easy to turn it into reality, it requires a real commitment from different companies with differing software platforms and methods of operation. Let’s look at the issues of achieving Real Process Management; In-line X-Ray has some challenges in this environment due to False Fails and Escapes, in short if you do not have accurate data you cannot achieve improvement easily or cost effectively. So, we promote 3D AOI as a faster, more technically advanced solution, but even these systems have an Achilles Heel, they cannot inspect joints on Bottom Terminated Components (BGA’s, CSP’s, QFN’s etc.) As they have only vision and height measurement, they can measure flatness and co planarity very well, but as in line x-ray they have to make a decision based on assumptions. Or at least that was the issue until now, when a technology is available to link 3D in-line AOI to At-Line X-Ray, allowing a decision to be made based on information from both systems, indeed SPI results and Pre-Reflow AOI results can also be considered.

The technology works like this: any height measurement of a BTC which the in-line 3D AOI “fails” is relayed to the At-Line X-ray and evaluated by its operator using all the technology at his disposal including ICT which gives a detailed view of all hidden joint interfaces.

The results and images are then fed to a Management Information System where a technician can review the SPI data, the 3D AOI data and the x-ray results, in real time on the same monitor. He can now use his judgment to accept or fail the board, can review historic data trends to fine-tune the AOI height limits and continuously improve the process by Intelligent Feedback. The use of a brain to filter the algorithms and images to ensure maximized yields, reduced rework and lower costs. This data can then be archived and shared with other lines, other factories or even with customers.

Reports can be made available to senior managers and customers showing the results of this Process Management, which is improved yields and reduced rework. In short, a process fully under control and utilizing the application of knowledge, tools and systems to measure, control, report and improve processes with the goal to meet the customer requirements profitably.

Keith Bryant A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing.  He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews.
He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years.
Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names and being Technology Editor for an Industry magazine for part of that time. From 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer.
Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4. He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.

16:00 -- Coffee Break

Enjoy complimentary coffee provided by eSmart Factory.

16:30 -- Panel Discussion

Brent Fischthal (Koh Young), Brian D’Amico (MIRTEC), Keith Bryant (Keith Bryant Consultants) – Moderator: Michael Ford

17:10 -- Conference Ends

Thank you for attending!  We will see you next year at the 2020 eSmart Factory Conference!


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