eSMART Factory Conference 2020

eSmart Factory 2020 - Outline Program

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eSmart Factory 2020 - Program - Day One

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Industry 4.0, IIOT, smart manufacturing, digitalization - various initiatives around the world are driving the emergence of advanced technologies within manufacturing. After the term "Industry 4.0" originally noted first ever back in 2011, today this initiative developed a momentum worth the term "fourth industrial revolution". But how much of the hype of digitalization is actually applicable to manufacturing? During this session the audience learns how Siemens steadily improved their manufacturing operations by applying an own definition of digitalization called Digital Enterprise Suite. Furthermore, additional use cases will be introduced reaching from Digital Twins over machine learning towards predictive maintenance embracing the overall concept of Industry 4.0 and ultimately benefit to manufacturers, customers and suppliers such as machine builders.

David is the Global Account Manager of Siemens specialized on the Electronics industry solely. For more than 15 years David gained an intense working experience in the field of Automation in Germany and Asia throughout the complete value chain including manufactuerers, EMS and End Customers. David gained domain knowledge along all aspects of Automation and Digitalization including IT-Security and industrial networks covering a holistic approach beyond the Industry 4.0 scope. He holds an Master degree in Automation and China Business Studies as well as an MBA from Mannheim Business School.

It is widely agreed that how we utilize the various forms of data now available across all of the various manufacturing technologies, will differentiate manufacturing in a revolutionary way. The question of course, is how. In reality, we already have experienced people who know how to run our factories. We may acknowledge that certain operational practices may need modification as Smart manufacturing technologies are introduced, but is there a truly disruptive change on the horizon that the analysis of data will create? Something that perhaps we were not expecting?

In this presentation, we explore the real-world potential that manufacturing data analysis will provide, showing how the results of analysis will be delivered and executed. We are not talking about just another report. Included are real-world, disruptive, and very disruptive technology changes.

Hemant Shah is group director of product management for PCB products at Cadence. He joined Cadence in late 2000 and is based in Chelmsford MA. Shah led the effort to create an industry wide consortium of design and supply chain companies to get IPC-2581 – the standard for transferring PCB design data to manufacturing – adopted. Prior to managing the PCB and FPGA products, he managed the Allegro Signal and Power Integrity products for PCB & IC Packaging. Shah also led an industry wide effort to get a new algorithmic modeling standard (IBIS-AMI) approved and adopted.

Prior to joining Cadence Hemant worked at Xynetix Inc. and before that at Intergraph Corporation. He is passionate about developing, marketing leading edge software products for PCB design.

Michael Ford, Working for Aegis Software provides him the opportunity to apply his many years of electronics assembly manufacturing experience, to drive both business and technology solution innovation that satisfies evolving needs in digital manufacturing.
Starting his career with Sony, including eight years working in Japan, Michael has created many solutions for manufacturing that blend a deep and broad knowledge of manufacturing with evolving software technologies. Today, Michael is an established thought leader for Industry 4.0 and digital Smart factories, an active contributor to industry standards together with the IPC, in the areas of the Connected Factory Initiative (CFX), traceability and the digital factory platform.

Sponsored by Koh Young

The majority of defects emanate from the printing process and most are paste related. Utilizing a novel new process system,paste can be characterized in the laboratory, the results uploaded to a secure cloud, available for donwload to a hand-held device that confirm the paste is fit for use. The results are stored in the cloud providing full traceability and quality control.

Augmented Reality, Next Generation Computing for Front Line Workers

Brian Toleno, Ph.D., Microsoft Corporation Director of New Technology

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The term "Industrie 4.0" was used for the first time in 2011 at the Hannover Fair. In October 2012 the Working Group on Industry 4.0 presented a set of implementation recommendations to the German federal government.Industry 4.0" refers to the concept of factories in which machines are augmented with wireless connectivity and sensors, connected to a system that can visualise the entire production line and make decisions on its own.Industry 4.0 fosters what has been called a "smart factory". Within modular structured smart factories, cyber-physical systems monitor physical processes, create a virtual copy of the physical world and make decentralized decisions. Over the Internet of Things, cyber-physical systems communicate and cooperate with each other and with humans in real-time both internally and across organizational services offered and used by participants of the value chain. So it’s been around for a while and is well defined with the keys being connectivity and ‘smart sensors’ to monitor operations and feedback data, we also see that this is NOT ‘lights out factory’ as it also mentions communicating and cooperating with humans, but not at what level this happens.This presentation will evaluate SMT production and inspection machines and attempt to define their status and potential to act as ‘smart sensors’, the first building blocks towards i4.0, this will lead to the answer to the question in the title.The author will visit Apex 2020 to gauge the latest state of the preparedness of the equipment and middle ware suppliers and add this to his presentation

A fully qualified engineer, Keith has over thirty years’ experience in Electronics Manufacturing. He is well known and respected for presenting technical papers at many high-profile events around the world and for his many published articles and interviews. He started his career in this industry with bare printed circuit boards in the early days of multi-layer technology, moving through to contract manufacturing. He had ten years’ experience with advanced materials and soldering systems before working with high technology x-ray and AOI Systems, again for 10 years. Then for almost 3 years Keith worked as a technology and business consultant, assisting many of the major industry names, from 2017 to 2019 he was Global Sales Director of the leading X-ray manufacturer. Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4.0.He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, in 2018 he was presented with the SMTA International Leadership award.

Recently reverting to a Consultancy role allowing him more freedom to pursue other projects, including i4. He was Chairman of the SMART Group for 11 years and is now Chairman of the recently formed SMTA Europe, last year he was presented with the SMTA International Leadership award.

The Smart Factory is starting to become a reality, as part of the over-arching Industry 4.0 paradigm. With the technology enablers such as Industrial internet of things (IIOT) and cloud computing, the electronics manufacturing operations technology (OT) are at a converging course with traditional information technology (IT). Beyond the challenges of data acquisition and transformation, the true 'proof of the pudding' is in the quick Return Of Investment (ROI) from advanced analytics. This is where domain knowledge application into the data science is paramount. We will share examples of successful profitable implementation of applied machine learning in the electronics manufacturing line, where measurement science meets data science using analytics .

Jack France, Keysight Technologies

The new SEMI Automation Standards family includes M2M communication standards for improving the communication between surface mount technology (SMT) assembly line equipment. The standard is a SMEMA-replacement for TCP-IP and PLC-based operating systems.  The standards were created with the objective of minimizing set-up times and design changes.  It also enables wireless connectivity for automatic-guided vehicles (AVGs). This presentation will provide the background and highlight the benefits of the new standards, as well as the recent adoptions and integrations. 


As Vice President of Collaborative Technology Platforms, Tom Salmon works with SEMI’s staff to ensure that members, standards users, and volunteers worldwide receive maximum value from their association with SEMI. Additionally, he manages a number of SEMI’s business and technology communities, including the Fab Owners Alliance, SEMI’s Smart Manufacturing initiative, the Electronic Materials Group, Advanced Packaging, and Secondary Equipment and Applications groups. Before joining SEMI, he held several management positions in manufacturing, logistics, customer relations, and sales.


Salmon is a member of the Heterogeneous Integration Roadmap Committee, the IEEE and the American Society of Association Executives, and holds a BA from the University of Minnesota and a Level One Proficiency Certificate from Japan’s Ministry of Education.


Sponsored by Koh Young

The world’s most innovative brands and established corporate symbols are building rockets, autonomous vehicles, medical devices, robots, and consumer electronics as quickly as they can innovate—but many of them are trying to build the tech of tomorrow while still relying on yesterday’s dated contract manufacturing processes for prototyping. For the average electronic device (regardless of industry or application), it takes fourteen iterations before it goes to market. Using the traditional contract manufacturing PCBA (printed circuit board assembly) model, each iteration alone takes up to three weeks to complete—and these iterations are largely completed behind closed doors, offering little transparency to engineers and insight into any potential design flaws or engineering issues. The chief defect of the traditional contract manufacturing model is that all of the machines and people in the smart factory are analog and disconnected. By leveraging a software-based platform that can automatically configure, operate, and monitor processes like prototyping and PCBA, today’s smart factories can fill the communication gap between designer and manufacturer and accelerate the iteration sequence. This use of IIoT automates the flow of information from the engineer’s design to the machines and the people on the smart factory floor in a continuous cycle of design, build, and test -- enabling designers and manufacturers to work synergistically in an end-to-end feedback loop to ensure quality, speed, and accuracy in PCB assembly. In this presentation, Shashank Samala, Co-Founder and Product Strategy Lead, Tempo Automation, will explain how a smart factory can leverage a software-based platform to increase levels of precision, predictability, and speed and, ultimately, empower engineers to bring their innovative technologies to market faster.

Malcolm Knapp

Malcolm Knapp joined Tempo Automation in 2018 with a goal to create more technical content and design resources for Tempo's customers and prospects. He has an MS in Electrical Engineering from Columbia University, and prior to joining Tempo he worked for over ten years in product development as an electrical engineer and product manager. Malcolm was also founder of The Engineer Accelerator, providing professional development courses and on boarding training to hardware engineers.

The following presenters will be invited to share their insight and knowledge in an interactive panel discussion, engaging with the audience”.

David Rogers

Michael Ford

Keith Bryant

Tom Salmon

See you on Day Two - Thursday, March 5th

Discover the full potential of a digitally optimized factory and the benefits that can be derived from implementing a Digital Twin at the design phase to reduce expensive and timely turns before production. Follow the digital journey throughout the manufacturing process and see demonstrations of real closed-loop DFM, materials management, line optimization and more...

eSmart Factory 2020 - Program - Day Two

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The story of a modern global manufacturer is one of ever-changing demand, fast deliveries, and quick decision-making. An influx of industry 4.0 technologies empowers manufacturers to meet these increasing challenges, but only after proliferation has been achieved. How can standardization be reached amid the complexities of a global enterprise? In this talk, we will explore how Flex unites its broad and diverse collection of factories and capitalizes on site-specific lessons learned to realize i4.0 at scale.


A regional lead for European i4.0 initiatives, John Pertsch drives standardization across the expansive network of Flex factories. With a background in industrial automation, quality, and technical program management, John has spent the past three years developing advanced manufacturing and i4.0 activities.

Transforming standard factories to smart, integrated factories is now closer than ever. NXTR is a high-end SMT pick ‘n place machine equipped with the world’s first automatic parts supply system Smart Loader. This platform improves quality and increases productivity, while freeing operators from repetitive work.

In today’s world, the electronics industry requires a fully optimized solder paste pattern. Stencil printers reach their limitations, where the challenge is to achieve an optimum print pattern with small board-to-board variations. These limitations can result in too little or no paste in difficult areas on the board, leading to lower quality and expensive, time consuming rework. Mycronic’s AI² solution inspects any solder pattern delivered from the stencil printer with a 3D SPI and send the data to a jet printer which will immediately repair and/or optimize the pattern. This guarantees today’s most relevant industry requirement: “A zero defect production and no scrap!”


Clemens Jargon serves as VP Global SMT at Mycronic AB. He has more than 25
years of experience in various functions and business areas and profound skills in
International Management in the Factory Automation Industry (SMT, Dispensing,
Coating, Automation & Robotics), Telecommunication as well as Semiconductor.
He is a recognized Industry 4.0 expert.

Sponsored by Koh Young

In the modern production environment, AOI system hardware and advanced algorithms are key to achieving highly accurate results in the shortest amount of time. However, in and of itself, it is not enough; without proper, easy and transparent programming procedures, even the most advanced hardware and algorithms will not produce the desired level of performance, and will provide little benefit. Consequently, the importance of an automatic, user-independent program creation process cannot be overrated.Developing an auto-programming functionality, which will work flawlessly in real production conditions, requires overcoming many challenges: The variety of PCB and component designs is immense; and the SMT components’ material, quality, marking, color and shape are insufficiently standardized. Additionally, the assembly and the reflow processes differ from product to the next, often in the same production line. Customer requests and q uality criteria may greatly vary, even for those who work at the same IPC level. To effectively cope with all these challenges, the use of artificial intelligence (IA) algorithms is invaluable. AI allows the AOI system to gather experience, constantly learn and improve its results. ALeader has been investing intensive efforts and resources in developing such an AI solution for several years. The abundant experience it has gathered from thousands of ALeader AOI installations in numerous production sites provides ALeader’s team with an advantage, allowing it to make quicker and more effective progress. The first results of its R&D efforts were presented in November 2019 at the Productronica show in Munich: they demonstrated the ability of ALeader’s Full 3D AOI ALD8720S to automatically define 70-80% of all the components on the board including size, positioning, solder joint inspection, OCR and color.

Dedicated tooling is considered a superior technology for SMT machines with critical impact on quality in the stencil printing process. Most SMT assembly will not use this method due to:
A. Delay in acquiring the tooling
B. High cost
C. Concern about sending sensitive assembly data to third parties
Disruptive technology using subtractive manufacturing to build dedicated tooling in- house on-demand.
Tooling made from material with a level of pliability optimized for SMT applications

Lunch Break

•Bobby Glidwell, Systems Engineering Manager, Magnalytix, LLC
•Jimmy Thorne, Systems Engineer, Magnalytix
•Anna Ailworth, System Engineer, Magnalytix
•Mike Bixenman, CTO, Magnalytix

All manufacturing processes result in residues on circuit assemblies in one form or the other. Manufacturing processes all have variation that is part of daily manufacturing. The residue condition can change due to component miniaturization, metallization; reflow parameters, rework, cleaning process conditions, and drift within the assembly line.

Process automation combined with machine learning reduces variability and enables the ability to produce highly dense electronics. Miniaturized components reduce the distance between conductors of opposite polarity. Assemblers using low-residue no-clean soldering materials must monitor automated processes to ensure residues left on the assembly are benign.

Monitoring cleanliness on high-speed assembly lines requires an electrical test method that produces real-time analytics. SMART Analytics ensures data capture and accuracy. SMART test instrumentation allows the assembler to dial in the process, characterize materials, and detects process drift. This simple to run instrumentation safeguards high-speed production, detects issues, eliminates human errors, and notifies process engineers when an out of spec condition occurs.

It's very exciting to hear the new technologies and innovative techniques moving forward in the electronics industry. Unfortunately, the final and secure disposition of electronics and electronic components is something that is given less thought. We simply dispose of it and hope it disappears. However, the potentially detrimental environmental effects and potential security risk posed by improper disposition has seen a large detriment in the environment and a security threat as data-bearing items have ended up in the wrong hands or back on the market as an unregistered/counterfeit item. Abington Reldan Metals is located in a secure facility that offers full-documentation/compliance and domestic final destination processing.

What data on materials, how does he make it smart

Sponsored by Koh Young

Thank you for attending!  We will see you next year at the 2021 eSmart Factory Conference!